Information handling system dynamic thermal transfer control

ABSTRACT

A portable information handling system transfers thermal energy associated with operation of a CPU to a location distal the CPU with a vapor chamber thermally interfaced with the CPU. A pressure adapter interfaced with the vapor chamber selectively changes the pressure within the vapor chamber to adjust the saturation point of a liquid in the vapor chamber that manages thermal transfer efficiency. For example, a controller interfaced with the pressure adapter modifies thermal transfer characteristics of the vapor chamber to control thermal conditions at the information handling system, such as in response to a temperature sensed at a housing surface, a battery, a display or at other locations of the information handling system.

CROSS REFERENCE TO RELATED APPLICATIONS

U.S. patent application Ser. No. 15/952,519, filed Apr. 13, 2018,entitled “Information Handling System Thermally Conductive Hinge” byinventors Travis C. North, Mark A. Schwager, Austin M. Shelnutt, andJohn T. Morrison, describes exemplary methods and systems and isincorporated by reference in its entirety.

U.S. patent application Ser. No. 15/952,525, filed Apr. 13, 2018,entitled “Information Handling System Housing Integrated Vapor Chamber”by inventors Travis C. North, Mark A. Schwager, Austin M. Shelnutt, andJohn T. Morrison, describes exemplary methods and systems and isincorporated by reference in its entirety.

U.S. patent application Ser. No. 15/952,528, filed Apr. 13, 2018,entitled “Information Handling System Housing Thermal ConduitInterfacing Rotationally Coupled Housing Portions” by inventors TravisC. North, Mark A. Schwager, Austin M. Shelnutt, and John T. Morrison,describes exemplary methods and systems and is incorporated by referencein its entirety.

U.S. patent application Ser. No. 15/952,538, filed Apr. 13, 2018,entitled “Graphite Thermal Conduit Spring” by inventors Travis C. North,Mark A. Schwager, Austin M. Shelnutt, and John T. Morrison, describesexemplary methods and systems and is incorporated by reference in itsentirety.

U.S. patent application Ser. No. 15/952,543, filed Apr. 13, 2018,entitled “Graphite Thermal Conduit Spring” by inventors Travis C. North,Mark A. Schwager, Austin M. Shelnutt, and John T. Morrison, describesexemplary methods and systems and is incorporated by reference in itsentirety.

U.S. patent application Ser. No. 15/952,551, filed Apr. 13, 2018,entitled “Information Handling System Thermal Fluid Hinge” by inventorsTravis C. North, Mark A. Schwager, Austin M. Shelnutt, and John T.Morrison, describes exemplary methods and systems and is incorporated byreference in its entirety.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates in general to the field of portableinformation handling system thermal management, and more particularly toan information handling system dynamic thermal transfer control.

Description of the Related Art

As the value and use of information continues to increase, individualsand businesses seek additional ways to process and store information.One option available to users is information handling systems. Aninformation handling system generally processes, compiles, stores,and/or communicates information or data for business, personal, or otherpurposes thereby allowing users to take advantage of the value of theinformation. Because technology and information handling needs andrequirements vary between different users or applications, informationhandling systems may also vary regarding what information is handled,how the information is handled, how much information is processed,stored, or communicated, and how quickly and efficiently the informationmay be processed, stored, or communicated. The variations in informationhandling systems allow for information handling systems to be general orconfigured for a specific user or specific use such as financialtransaction processing, airline reservations, enterprise data storage,or global communications. In addition, information handling systems mayinclude a variety of hardware and software components that may beconfigured to process, store, and communicate information and mayinclude one or more computer systems, data storage systems, andnetworking systems.

Portable information handling systems process information withprocessing components disposed in a portable housing. Generally,portable information handling systems are configured to supportoperations free from external peripheral devices and/or cabledconnections. For example, portable information handling systemstypically integrate a display for presenting information as visualimages, an input device for accepting inputs from an end user, awireless communication device to communicate with a network, and abattery to power processing components when external power is notavailable. Convenient operations without interfacing to externalresources allow end users to readily access information on the go andaway from an enterprise or home work environment.

Portable information handling systems generally have a tabletconfiguration or a convertible configuration. A tablet configurationtypically integrates a display on one side of a planar housing to coverprocessing components disposed in the planar housing. Often, atouchscreen display provides the only integrated input device for atablet by accepting touches at a user interface presented on thedisplay. Tablet information handling systems' relatively flat housingsand minimal input device provide a thin and light weight system,however, interactions that involve end user inputs tend to be more timeconsuming in the absence of a keyboard input device. Convertibleinformation handling system configurations generally include multiplehousing portions rotationally coupled to each other by a hinge. Thehousing portions rotate 90 degrees relative to each other from a closedposition to a clamshell position that presents a display integrated in alid housing portion at a viewing orientation relative to a base housingportion that rests on a desktop or other support surface. Someconvertible information handling systems rotate the housing portions 360degrees relative to each other to expose the display in a tabletfootprint having the base portion underneath. An advantage of theconvertible configuration is that a physical keyboard can integrate inthe base housing portion to provide an enhanced end user input device.

One difficulty with convertible information handling systemconfigurations is that rotationally coupling housing portions to eachother tends to increase the thickness of the system. Typically, a lidhousing portion integrates the display and interfaces with a mainhousing portion that integrates processing components, such as a centralprocessing unit (CPU), random access memory (RAM), a graphics processorunit (GPU) and persistent storage. A hinge assembly couples to the lidand main housing portions to support rotation of the housing portionsrelative to each other. A keyboard integrates in the main housingportion and covers the processing components. The housing portions andhinge assembly have to provide sufficient robustness to withstandmultiple cycles of opening and closing without twisting and torsionalforces introduced by rotation placing excessive mechanical stress on thedisplay and processing components.

Another difficulty with convertible information handling systemconfigurations is that processing component power dissipation is limitedby thermal constraints that include a maximum temperature associatedwith the each processing component and a maximum temperature of thehousing surface. In particular, CPU operation tends to dissipate powerat a concentrated location that can result in excessive thermalconditions. Generally, if a CPU reaches a temperature threshold, the CPUwill throttle power consumption by operating at a lower clock speed thatdissipates less power. Typically, lower CPU clock speeds will reducethermal conditions within the housing so that excessive external housingsurface temperatures do not cause end user discomfort. However, as CPUclock speed reduces, processing speeds also decrease, resulting inslower system response.

Larger portable information handling system housings generally supportmore powerful processing components because more room is availablewithin the housing to separate the components and dissipate excessthermal energy. Larger-sized portable housings often have room toinclude active cooling systems, such as a cooling fan that blows acooling airflow over the CPU. Additional thermal dissipation is oftenprovided by a heat sink coupled to the CPU, especially where the heatsink has vertical space to extend fins into the cooling airflow.Generally, the cooling fan draws in cooling airflow at an intake vent,passes the cooling airflow across the CPU and heat sink, and exhauststhe cooling airflow out an outtake vent that blows away from the enduser.

Active cooling systems tend to increase the size of a portable housingand also increase power consumption. Typically, low profile informationhandling system housings lack room to support active cooling. Instead,such systems tend to rely upon passive cooling to dissipate excessthermal energy. For example, heat pipes provide thermal energy transferfrom hotspots, such as at the CPU, towards an area where the thermalenergy may passively transfer to the external environment. Generally,passive cooling limits thermal dissipation to CPUs of 5W power, althoughspecific housing configurations vary depending upon size, thickness andmaterials. In some instances, low profile housing passive thermaltransfer may support higher transient CPU power consumption levels,however, extended operations at high power dissipations tends toeventually result in CPU throttling and decreased performance. Althoughnew low power CPUs perform well at lower clock speeds, the fullpotential of such CPUs at expected transient power dissipations can callfor 10W or more of passive thermal transfer capability.

SUMMARY OF THE INVENTION

Therefore, a need has arisen for a system and method which enhancespassive transfer of thermal energy from a low profile informationhandling system housing.

A further need exists for a system and method which dynamically controlspassive thermal transfer at an information handling system.

A further need exists for a system and method that distributes thermalenergy through a hinge for rejection at a rotationally coupled housingportion.

A further need exists for a system and method that integrates a vaporchamber into an information handling system housing for rejection ofthermal energy at the housing surface.

A further need exists for a thermal conduit that transfers thermalenergy between rotationally coupled housing portions.

In accordance with the present invention, a system and method areprovided which substantially reduce the disadvantages and problemsassociated with previous methods and systems to passively transferthermal energy from an information handling system housing. Thermalenergy generated by power dissipation at a first housing portion, suchas execution of instructions on a CPU, is transferred through a thermalconduit to a second rotationally coupled housing portion for rejectionto an external environment. In various embodiments, the thermal conduitpasses through one or more hinges rotationally coupling the housingportions to each other and has the amount of thermal energy that istransferred managed by altering thermal characteristics of thermalconduits and/or thermal dissipation devices integrated in the housingportions. For instance, one or more vapor chambers integrated in one ormore housing portions alters an internal pressure to adapt a saturationpoint for fluid phase change, thus adjusting the efficiency of thermaltransfer across the vapor chamber. Management of thermal transfer athousing portions provides a tool for maintaining housing portion outersurfaces and internal components within a temperature threshold.

More specifically, an information handling system processes informationwith processing components disposed in a housing, such as a CPU andmemory that coordinate execution of operating system and applicationinstructions. Dissipation of power to run the processing componentsgenerates thermal energy that heats the processing components. In orderto run the processing components at full power dissipation, thermalenergy is transferred from the processing components and dissipatedacross a surface area to decrease the amount of temperature increase fora given thermal energy release. For example, thermal energy released bya CPU is transferred to a vapor chamber that uses phase change of afluid between liquid and gas states to efficiently dissipate the thermalenergy. In one embodiment, the information handling system has two ormore portions rotationally coupled to each other through one or morehinges and a thermal energy dissipation device, such as a vapor chamber,integrated in a housing portion that does not include the CPU. Forinstance, a main housing portion includes a CPU and other processingcomponents disposed under a keyboard and a lid housing portion includesa display that presents information processed by the CPU. Thermal energygenerated by the CPU is transferred to the lid housing portion fordissipation and rejection to the external environment. A thermal conduitthat transfers the thermal energy may include liquid tubes that pumpheated liquid through a hinge, a layered graphite cable or spreader thatconducts heat in plane across the housing portions, or the hinge bodyitself. In one embodiment, the amount of thermal energy transferred ismanaged by adjusting the pressure within one or more vapor chambers tochange the saturation point of the fluid in the vapor chamber, thusadapting the efficiency with which thermal energy is transferred.Thermal energy transferred to a lid housing portion is dissipated with athermal spreader or vapor chamber in the lid housing portion. In oneembodiment, a vapor chamber is defined with layered sheets of materialthat form the lid housing portion so that thermal energy is rejectedthrough the lid housing portion outer surface.

The present invention provides a number of important technicaladvantages. One example of an important technical advantage is enhancedpassive transfer of thermal energy from a low profile informationhandling system. Thermal energy rejects more efficiently from aninformation handling system with a greater surface area exposed to anexternal environment. Further, thermal energy rejects more efficientlyfrom a vertically raised surface as thermal energy rises. Thus,transferring thermal energy to a lid housing portion improves passivethermal cooling as the lid housing portion generally doubles the surfacearea from which thermal energy is rejected and is raised in a verticalorientation to hold a display integrated in the lid housing portion in aviewing position.

Another example of an important technical advantage is dynamic controlof passive thermal energy rejection to manage information handlingsystem component and housing temperatures. For example, manipulating thepressure within a vapor chamber adjusts the saturation point of a fluidin the vapor chamber, thus adapting the efficiency with which thermalenergy is dissipated across the vapor chamber. Active control ofpressure in one or more vapor chambers manages temperatures at locationsthroughout an information handling system. For instance, if a lidhousing portion outer surface reaches too high of a temperature,increasing the pressure within a vapor chamber of the lid housingportion decreases thermal energy transfer to lower the outer surfacetemperature. In one embodiment, pressure management is automated with awax motor that melts to increase pressure when temperatures reach adefined threshold.

Another example of an important technical advantage is distribution ofthermal energy between housing portions across a hinge that rotationallycouples the housing portions to each other. For example, a hinge bodyprovides a thermal transfer path with thermally conductive materialdisposed in the hinge body, such as a liquid, a vapor chamber or thehinge body itself.

Another example of an important technical advantage is distribution ofthermal energy between rotationally coupled housing portions independentof the hinges coupling the housing portions to each other. For example agraphite sheet or plural layers of graphite sheets provide excellent inplane thermal conduction to transfer thermal energy between housingportions. Graphite formed in the shape of a torsion spring interfacesbetween housing portions with minimal disruption of information handlingsystem operation, such as by wrapping around a hinge pin or shaft, orrouting through a slot defined by parallel bars that maintain a minimalbend radius to protect the thermal transfer material from cracking orbreaking.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention may be better understood, and its numerousobjects, features and advantages made apparent to those skilled in theart by referencing the accompanying drawings. The use of the samereference number throughout the several figures designates a like orsimilar element.

FIG. 1 depicts a block diagram of a portable information handling systemconfigured to dissipate thermal energy across rotationally coupledhousing portions;

FIG. 2 depicts a cutaway view of an information handling system lidportion that illustrates an example embodiment for managing thermaltransfer between housing portions;

FIGS. 3A and 3B depict a side cutaway view of a wax motor actuator thatcontrols thermal transfer at an information handling system;

FIG. 4 depicts a side cutaway view of a solenoid motor actuator thatcontrols thermal transfer at an information handling system;

FIG. 5 depicts a flow diagram of a process for managing thermal energytransfer between separate housing portions;

FIG. 6 depicts a top view of an information handling system configuredwith thermal energy dissipation devices that spread thermal energyacross separate housing portions;

FIG. 7 depicts a side perspective view of a hinge rotationally couplingmain and lid housing portions through a thermally conductive hinge body;

FIG. 8 depicts a cutaway view of a hinge 18 having a thermal conduitinserted into a conductive barrel to conduct thermal energy across thehinge body;

FIG. 9 depicts a cutaway view of a hinge having a fluid filled body thattransfers thermal energy between rotationally coupled housing portions;

FIG. 10 depicts a side perspective view of a hinge having thermalconduits integrated through synchronized axes to exchange thermal energyat the hinge body;

FIG. 11 depicts a side cutaway view of a hinge integrating a vaporchamber that transfers thermal energy between thermal conduits coupledto the hinge and rotationally coupled housing portions;

FIG. 12 depicts an exploded view of a hinge having thermal transferperformed with an integrated vapor chamber;

FIG. 13 depicts a bottom perspective cutaway view of an informationhandling system having liquid fluid thermal energy transfer through adual axis hinge;

FIG. 14 depicts a side perspective view of a hinge having liquid pumpedthrough each axis to support thermal transfer between informationhandling system housing portions;

FIG. 15 depicts a side perspective view of an information handlingsystem lid housing portion that integrates a vapor chamber to dissipateand reject thermal energy received from a main housing portion;

FIG. 16 depicts a side view of a protrusion and opening configured toaccept a thermal conduit that transfers thermal energy from a mainhousing portion;

FIG. 17 depicts a side perspective view of a thermal conduit insertedinto a protrusion to transfer thermal energy to a lid housing portion;

FIG. 18 depicts a side cutaway view of a vapor chamber integrated at aprotrusion extending from a lid housing portion;

FIG. 19 depicts a portable information handling system in a clamshellopen configuration that transfers thermal energy from main housingportion to a lid housing portion with a thermal conduit disposed througha single axis hinge;

FIG. 20 depicts an example of a thermal conduit routed through outer andinner portions of a single axis hinge;

FIG. 21 depicts an alternative arrangement for passing a thermal conduitthrough a hinge 18 inner periphery mounting location;

FIG. 22 depicts a lid housing portion integrating a thermal conduit thattransfers thermal energy for dissipation across the lid housingportion's surface area;

FIG. 23 depicts a side cutaway view of an example of a thermal conduithaving plural layers of graphene;

FIG. 24 depicts an alternative cable configuration in which multiplesheets of graphite are layered on top of each other and then rolled intoa cable form having an outer protective layer;

FIG. 25 depicts a multilayered graphite thermal conduit configured totransfer thermal energy from a vapor chamber with multiple thermalinterface connection points dispersed across the surface of the vaporchamber;

FIG. 26 depicts a multilayered graphite thermal conduit having each ofplural layers thermally interfaced at dispersed locations of a heat sinkand information handling system lid portion;

FIG. 27 depicts an information handling system in a clamshell openconfiguration having a layered graphite thermal spreader cut and foldedto interface housing portions in a torsion spring configuration;

FIG. 28 depicts a graphite sheet cut to wrap around a hinge shaft in atorsion spring configuration;

FIG. 29 depicts opposing graphite thermal spreaders interfaced through astrip that supports multiple wraps around a hinge pin or shaft;

FIG. 30 depicts a side perspective view of an information handlingsystem having graphite thermal spreaders extended across substantiallyall first and second rotationally coupled housing portions;

FIG. 31 depicts a side perspective view of the information handlingsystem having the housing portions rotated to a closed position;

FIG. 32 depicts a side cutaway view of an information handling systemgraphite thermal spreader managed in a closed configuration by atensioning assembly;

FIG. 33 depicts a side cutaway view of an information handling systemgraphite thermal spreader managed in a tablet configuration by atensioning assembly;

FIG. 34 depicts an upper perspective exploded view of a graphite thermalspreader aligned to couple with an information handling system;

FIG. 35 depicts an upper perspective view of a parallel tension barassembly configured to rotate with a thermal spreader captured in a slotto maintain tension across the thermal spreader; and

FIG. 36 depicts an exploded view of both ends of a parallel tension barassembly having a clutch assembly that adapts tensioning bar orientationto variations in thermal spreader tension;

FIGS. 37A and 37B depict an example of tension adjustments applied bythe tensioning bar clutch assembly;

FIG. 38 depicts an exploded view of a hinge configured to couple with aparallel tension bar assembly; and

FIG. 39 depicts an exploded view of a hinge configured to couple with aparallel tension bar assembly.

DETAILED DESCRIPTION

An information handling system transfers thermal energy betweenrotationally coupled housing portions to improve thermal dissipation andrejection. For purposes of this disclosure, an information handlingsystem may include any instrumentality or aggregate of instrumentalitiesoperable to compute, classify, process, transmit, receive, retrieve,originate, switch, store, display, manifest, detect, record, reproduce,handle, or utilize any form of information, intelligence, or data forbusiness, scientific, control, or other purposes. For example, aninformation handling system may be a personal computer, a networkstorage device, or any other suitable device and may vary in size,shape, performance, functionality, and price. The information handlingsystem may include random access memory (RAM), one or more processingresources such as a central processing unit (CPU) or hardware orsoftware control logic, ROM, and/or other types of nonvolatile memory.Additional components of the information handling system may include oneor more disk drives, one or more network ports for communicating withexternal devices as well as various input and output (I/O) devices, suchas a keyboard, a mouse, and a video display. The information handlingsystem may also include one or more buses operable to transmitcommunications between the various hardware components.

Referring now to FIG. 1, a block diagram depicts a portable informationhandling system 10 configured to dissipate thermal energy acrossrotationally coupled housing portions. In the example embodiment, a mainhousing portion 12 and lid housing portion 14 of substantially the samesize and dimensions rotationally couple to each other with a hingeassembly 16 having first and second hinges 18 at opposing corners of thehousing portions. In various embodiments, hinges 18 support rotation ofhousing portions 12 and 14 relative to each other by 90, 180 and up to360 degrees, such as to support a clamshell configuration or tabletconfiguration. In the example embodiment, main housing portion 12contains processing components that process information and generateheat as a byproduct of the power dissipated through the processingcomponents. For example, a CPU 22 executes instructions of an operatingsystem and one or more applications stored in a solid state drive (SSD)26 and retrieved to random access memory (RAM) 24 to processinformation, such as visual information for presentation at a display38. A chipset 28 includes processors and embedded code that managesinteractions between CPU 22 and physical devices, such as to applypower, charge a battery 35 or process information into pixel valuespresentable at a display. For example, chipset 28 typically includes orcooperates with an embedded controller 30 that manages operating systemboot and accepts end user inputs from a keyboard 52. In alternativeembodiments, alternative configurations of processing components may beused to provide desired functionality, as is known in the art ofprocessing information. Although the example embodiment illustratesthermal transfer across housing portions, in alternative embodiments,the thermal transfer techniques described herein may be used in tabletsystems or in other types of physical devices to transfer thermal energywithin a single housing portion.

In the example embodiment and similar systems, processing componentstend to generate heat in concentrated areas of main housing 12. CPU 22,in particular, generates concentrated thermal energy that, if notproperly managed, will exceed temperature constraints and damageprocessing capabilities. Conventional information handling systemsattempt to dissipate the thermal energy from the location of CPU 22 witha heat sink 32 and heat pipes made of thermally-conductive material. Forexample, heat sink 32 couples directly to CPU 22 to absorb thermalenergy and includes fins to transfer the thermal energy to air in a moreefficient manner by increasing the surface area from which thermalenergy can be rejected. As thermal energy dissipates away from CPU 22,the temperature of CPU 22 is reduced to allow operation at greaterlevels of power dissipation, such as at higher clock speeds that processinformation more quickly. If CPU 22 generates too much heat toefficiently dissipate away, CPU 22 typically throttles its operation toreduce processing speed, power consumption and heat generation.Generally, with passive thermal rejection through a heat sink, thetemperature of CPU 22 will depend upon the space available for transferof thermal energy to air within main housing portion 12. Concentrationsof rejected thermal energy near the processor not only restricts powerdissipation at CPU 22 but tends to create hot spots at the outer surfaceof housing 12 near CPU 22 that can cause end user discomfort.

In the example embodiment, a vapor chamber 34 integrates into mainhousing portion 12, such as by coupling to heat sink 32 or CPU 22, tospread thermal energy throughout main housing portion 12. Generally,vapor chamber 34 is a sealed chamber that includes a fluid, such aswater, at a reduced pressure that lowers the saturation point at whichthe fluid transitions between liquid and gaseous states. Vapor chamber34 uses phase transition energy characteristics to aid in thermaltransfer. For instance, water absorbs thermal energy to transition fromliquid to gaseous states while remaining at the saturation pointtemperature so that liquid located near CPU 22 absorbs thermal energy tosupport transition to the gaseous phase. Once in a gaseous phase, thefluid transports absorbed thermal energy away from CPU 22 more readilyas a gas than as a liquid to release the thermal energy in a phasetransition from gas to liquid distal CPU 22. The fluid then wicks backtowards CPU 22, typically with the help of a mesh, to repeat absorptionand transfer of thermal energy. On a system level, the effect of thermaltransfer by vapor chamber 34 is to spread thermal energy across agreater area so that the hotspot near CPU 22 has a reduced temperaturewhile the temperature across main housing 12 increases. Dissipation ofthermal energy across a greater surface area offered by vapor chamber 34also provides more efficient rejection of thermal energy frominformation handling system 10. For instance, in one example embodiment,vapor chamber 34 thermally couples to main housing 12 to provideadditional thermal absorption and exposure at the outer surface ofhousing 12 for thermal rejection the external environment.

In order to further expand the external surface area that rejectsthermal energy from information handling system 10, a second vaporchamber 34 integrates with information handling system 10 in lid housingportion 14 and interfaces with thermal energy from main housing portion10 through a thermal conduit 40. Lid housing portion vapor chamber 34includes a funnel base 36 so that when lid housing portion 14 rotates toa raised position, gravity forces the fluid in liquid form towards theinterface with thermal conduit 40. As fluid in vapor chamber 34transitions to a gaseous state, heat transfer with the fluid in agaseous state for release across vapor chamber 34 at transition back toa liquid state. Funnel base 36 aids wicking of the fluid back to a heatsource interfaced with thermal conduit 40 to encourage dissipation ofthermal energy across lid housing portion 14. In addition, other massesassociated with lid housing portion 14 may thermally interface withvapor chamber 34 to aid in absorption and rejection of thermal energy tothe external environment. For example, battery 35 may thermallyinterface with vapor chamber 34 to absorb thermal energy. Alternatively,lid housing portion 14 may thermally interface with vapor chamber 34 toabsorb and reject thermal energy. As the mass and surface areaassociated with absorption and rejection of thermal energy increase, thetemperatures associated with various components of information handlingsystem 10 at a given thermal energy state will remain lower.

One difficulty with dissipation of thermal energy across both housingportions 12 and 14 of information handling system 10 is that rejectionof thermal energy from the outer surfaces of main housing portion 12 andlid housing portion 14 can increase temperatures to a point at which anend user may experience discomfort. For example, efficient thermalenergy transfer from CPU 22 to main housing portion 12 may increase thebottom surface temperature so that a laptop resting on a lap wouldbecome uncomfortable, although the same laptop on a desktop surface ordocking station would operate well within thermal constraints.Similarly, efficient thermal energy transfer through thermal conduit 40to lid housing portion 14 can increase temperatures of the outer surfaceof lid housing portion 14 to a level that is not comfortable for an enduser. In addition, battery 35 and display 38 are often themselvesthermal energy sources that add thermal energy to lid housing portion 14in certain circumstances and impose thermal constraints due to theiroperating limitations. For instance, a battery 35 of lithium ionconstruction tends to have a thermal limit of 40 degrees C. and tend toheat when charging. As another example, a display 38 of OLEDconstruction generates thermal energy at different levels based upon thecolor and brightness of visual images so that the temperature of lidhousing portion 14 may vary based upon heat output by display 38. Lidhousing portion 14 temperature may be managed to remain below a limit ofan OLED display 38 and also to aid in the presentation of visual imagesby adjusting temperature to provide desired presentation characteristicsbased upon the visual image to be presented.

In order to manage transfer of thermal energy across various portions ofinformation handling system 10, a thermal controller 56 interfaces withone or more actuators to control thermal energy based upon temperaturessensed by temperature sensors 54 disposed across information handlingsystem 10 and integrated with various processing components, such as CPU22. In the example embodiment, thermal controller 56 is embedded codestored in non-transient flash memory and executed by embedded controller30 of chipset 28. In alternative embodiments, thermal controller 56 mayinclude a variety of hardware and software components distributed acrossinformation handling system 10, such as a driver of an operating systemor option ROM of a device component. Thermal controller 56 monitorsthermal conditions across information handling system 10 and actuatesactuators to adjust thermal transfer so that thermal constraints aremet. For instance, thermal controller 56 maintains the temperature ofmain housing 12 outer surface below a first threshold if accelerationsindicate movement of information handling system 10, a second thresholdif a lack of accelerations indicate information handling system 10 restson a desktop, and a third threshold if a docking station is coupled thatincludes additional thermal absorption capabilities. In one exampleembodiment, thermal controller 56 allows full transfer of thermal energythrough vapor chambers 34 and thermal conduit 40 until a temperaturethreshold is reached at lid housing portion 14, and then restrictsthermal transfer to lid housing portion 14 to main the temperature belowthe threshold. Reducing thermal transfer to lid housing portion 14 tendsto increase temperatures at main housing portion 12 so that thermalcontroller 56 may have to throttle CPU 22 to reduce the amount ofthermal energy generated.

One way to manage thermal energy transfer throughout informationhandling system 10 is to use actuators controlled by thermal manager 56to adjust the efficiency at which vapor chambers 34 and thermal conduit40 transfer thermal energy. In one example embodiment, a solenoid 44actuates a plunger 42 within a vapor chamber 34 to adjust the efficiencyof vapor chamber 34 for transferring thermal energy. For example, if atemperature sensed at battery 35 reaches a threshold, thermal controller56 actuates solenoid 44 to change the pressure within vapor chamber 34,thus changing the saturation point at which vapor chamber 34 transportsthermal energy in a gaseous state. Increasing pressure within vaporchamber 34 increases the saturation point and thus the temperature atwhich a fluid in vapor chamber transitions from liquid to gaseous formso that thermal energy is translated across vapor chamber 34 lessefficiently. Less efficient thermal energy transfer generally results inhigher temperatures at the thermal hot spot, such as the location atwhich heat sink 32 interfaces with vapor chamber 34, and lowertemperatures at locations distal the thermal hot sport, such as alocation at which thermal conduit 40 interfaces with vapor chamber 34 toconduct thermal energy to lid housing portion 14. Thus, for example,increasing pressure in vapor chamber 34 such as by inserting plunger 42into vapor chamber 34 to increase the pressure and saturation point,will result at a given CPU 22 power dissipation in a greater CPU 22temperature and a reduced battery 35 temperature. Similarly, thetemperature at the outer surface of main housing 12 will be less evenlydistributed with a greater hot spot at CPU 22 as vapor chamber 34 losesefficiency at higher saturation points for transfer of thermal energy.Thermal controller 56 weighs sensed temperatures based upon operatingconditions to adjust thermal transfers appropriately, such as tomaintain thermal constraints associated with components (CPU 22, battery35, display 38, etc.) and sensed conditions (accelerations, userpresence, housing orientation, docking station resources, etc.).

Another example of vapor chamber 34 thermal efficiency management isdepicted with vapor chamber 34 in lid housing portion 14 and itsintegrated microfluidic bladder 46. A microfluidic pump 50 interfaceswith a microfluidic reservoir 48 to change the displacement ofmicrofluidic bladder 46 within vapor chamber 24, thus altering thepressure and saturation point within vapor chamber 34. As analternative, pump 50 and reservoir 48 may interface directly with vaporchamber 34 to change the amount of fluid in vapor chamber 34, thuschange the pressure and saturation point of the fluid as the fluid inliquid form displaces space within vapor chamber 34. In the exampleembodiment, the availability of saturation point control in both vaporchambers 34 provides thermal controller 56 with a tool that not onlymanages the amount of thermal transfer between housing portions 12 and14 but also the direction of thermal transfer. For example, a graphicscontroller disposed separate from chipset 28 and within lid housingportion 14 may generate considerable thermal energy when processingheavy loads, such as graphics associate with a game. In such asituation, thermal energy generated within lid housing portion 14 mayexceed thermal energy generated in main housing portion 12 so thattransfer of thermal energy from lid housing 14 to main housing portion12 enhances graphics processing. The distribution of thermal energy mayalso change if external resources provide additional cooling at mainhousing portion 12, such as with the use of a base docking station thatoffers cooling underneath main housing portion 12. In such a situation,setting the vapor chamber 34 in lid housing portion 14 to have a lowsaturation point relative to the vapor chamber 34 in main housingportion 12 has the effect of creating a second hot spot where thermalconduit 40 couples to the main housing portion 12 vapor chamber 34.Thus, as thermal energy transfers through thermal conduit 40 from lidhousing portion 14 to main housing portion 12, the thermal energy ismore efficiently removed to allow operation of the graphics processing.In alternative embodiments, alternative arrangements for managing theamount and direction of thermal transfer may be used, such as those setforth in greater detail below.

Referring now to FIG. 2, a cutaway view of information handling system10 lid portion 12 illustrates an example embodiment for managing thermaltransfer between housing portions. In the example embodiment, vaporchamber 34 is configured as a loop heat pipe having an evaporator 62that accepts thermal energy through a thermal interface 64 to evaporatethe fluid from a gaseous to a liquid state and a condenser 66 thatcondenses fluid from a gaseous to a liquid state. The loop portion maybe provided by tubing disposed in lid housing portion 14 or withchannels formed in lid housing portion 14, such as channels cut in aplate or between two layers of sheet material that are sealed together.Thermal energy is absorbed during phase change to the gaseous state andreleased during phased change to the liquid state for rejection 68 tothe external environment, such as through the surface area of the outersurface of housing portion 14. A compensator chamber 60 pools thecondensed fluid in liquid form so that a piston 58 can adjust the volumeof the vacuum system by changing its insertion position withincompensator chamber 60 in response to an actuator 44, such as asolenoid. As pressure increases within, the saturation point increasesto increase the temperature at which gas and liquid state changes occurand decrease the efficiency at which thermal transfer takes place.Reducing the efficiency of thermal transfer tends to decrease thedistribution of thermal energy from main housing portion 12 to lidhousing portion 14 to reduce the temperature at lid housing portion 14.Retracting piston 58 out of chamber 60 decreases the pressure andsaturation point to increase thermal transfer efficiency and thetemperature a lid housing portion 14. Thus, for example, outer surfacetemperatures, accelerations and user settings may be applied to adaptthermal distributions throughout information handling system 10. Forinstance, a system on a desktop interfacing through a peripheralkeyboard may tolerate higher outer surface temperatures than a systemfolded into a tablet configuration that is experiencing movementsassociated with end user touches to the outer surface.

Referring now to FIGS. 3A and 3B, a side cutaway view depicts a waxmotor actuator that controls thermal transfer at an information handlingsystem 10. FIG. 3A of the example embodiment depicts the wax motor in aretracted position having wax expansion material 70 in solid formdisposed against a cup structure 72 containing plug 74 with a diaphragmseparating wax 70 from plug 74. An anti-chafing disc 76 separates plug74 from a piston 80 disposed in a guide 78. FIG. 3B of the exampleembodiment depicts the wax motor in an extended position that provides aload for a stroke length of piston 80. Heat applied to wax expansionmaterial 70 melts wax expansion material 70 from a solid to a liquidform causing expansion of the wax expansion material 70 and a resultingforce against plug 74 that moves piston 80 in guide 78. By interfacingpiston 80 to a pressure adapter of a vapor chamber, the pressure withinthe vapor chamber adapts the saturation point of the vapor chamber atthe temperature at which wax expansion material 70 transitions betweenliquid and solid states. In one embodiment, the melting temperature ofwax expansion material 70 substantially matches a maximum temperatureassociated with a housing portion sot that the wax motor increasespressure within a vapor chamber as the vapor chamber reaches a maximumtemperature so that thermal transfer efficiency of the vapor chamber isdecreased. As an example of such a passive thermal transfer control, awax motor may be integrated within a hinge that includes a vapor chamberto transfer thermal energy between housing portions. As the hingereaches the wax melting point, the wax expands to increase pressurewithin the hinge vapor chamber and thus reduce thermal transfer. Inalternative examples, heat may be applied at the wax to melt the waxwith active control when a change in vapor chamber efficiencycharacteristics is desired.

Referring now to FIG. 4, a side cutaway view depicts a solenoid motoractuator that controls thermal transfer at an information handlingsystem 10. In the example embodiment, a case 82 includes magnetic fluxlines 84 and contains a coil winding around a plunger 88 that is biasedby a return spring 90. A piston 92 extends from plunger 88 and has itsposition adjusted by current applied at an electrical connection 94. Acontroller, such as an embedded controller, actively manages pressurewithin a vapor chamber by applying current to electrical connections 94,such as with a GPIO or other interface. Piston 92 interfaces with avapor chamber to adjust pressure by moving a pressure adjusting devicewithin the vapor chamber.

Referring now to FIG. 5, a flow diagram depicts a process for managingthermal energy transfer between separate housing portions. For example,a pressure adapter within a vapor chamber of a lid housing portionmanages the efficiency of the vapor chamber to spread thermal energy atthe lid housing portion, such as to control the surface temperature ofthe lid housing portion. The process starts at step 96 and proceeds tostep 98 to capture temperature and pressure data associated with thermalmanagement at an information handling system. For example, an embeddedcontroller or operating system module collects temperatures fromtemperature sensors to monitor thermal conditions across the informationhandling system housing portions, and determines the pressure andtemperature of vapor chambers that have configurable thermal transfersettings. At step 100, pressure adapter settings are captured for thevapor chambers that have configurable thermal transfer settings, such asthe position of pistons within the vapor chambers, the size of bladderswithin the vapor chambers, the temperature of fluid within vaporchambers, the amount of fluid within vapor chambers, etc. . . . At step102, system power dissipation is captured to analyze thermal energycreation in the housing portions. For example, CPU clock speed andprocessing modes indicate CPU power draw, as do active applications andpending processing tasks. Other examples of thermal energy sources thatmay vary based on system operations include graphics processing, displaysettings and battery charging. Analysis of power used at the thermalenergy sources provide an estimate of the amount of thermal energy thatthe information handling system has to reject. Comparison of the thermalstate of the information handling system as determined by the sensedtemperatures and configurable vapor chamber settings with the thermalenergy generated by information handling system operations provides anestimate for the system's ability to absorb additional thermal energywithout exceeding thermal constraints, such as CPU, display, battery orouter surface temperature thresholds. In various example embodiments, athermal controller balances thermal constraints and operational powerneeds with a feedback look and control algorithm that controls availablethermal dissipation tools, such as vapor chamber pressure and thermalconduit interfaces.

In the example embodiment, the process continues to step 104 todetermine if the information handling system lid housing portion outersurface has an over temperature condition. In alternative embodiments,other information handling system components may be monitored, such as amain housing outer surface temperature or a thermal spreadertemperature, such as vapor chamber. In one alternative embodiment,multiple temperatures are monitored to predict that an over temperaturewill occur. If no over temperature is found at step 104, the processcontinues to step 106 to determine if the pressure adapter in the vaporchamber is at 100%, meaning that vapor chamber thermal transferefficiency is fully available. If not, the process continues to step 108to open the pressure adapter so that additional thermal energy istransferred across the lid housing portion and then to step 98 tocontinue monitoring of thermal conditions. If at step 106 the vaporchamber is set at full efficiency, the process returns to step 98 tocontinue monitoring thermal conditions.

If at step 104 a lid housing portion over temperature is determined, theprocess continues to step 110 to determine if a main housing overtemperature exists. If the main housing portion does not have an overtemperature, the process continues to step 112 to close the pressureadapter so that thermal energy transfer efficiency to the lid housingportion is decreased, and then the process returns to step 98 tocontinue thermal management monitoring. Decreasing the thermalefficiency transfer at the lid housing portion reduces the temperatureof the lid housing portion with a corresponding reduction in thermaltransfer from the main housing portion to the lid housing portion. Thereduction in thermal transfer from the main housing portion tends toincrease the temperature of the main housing portion. If at step 110 themain housing portion has an over temperature, the process continues tostep 114 to throttle the system CPU and/or other system resources thatgenerate thermal energy. The process then continues to step 98 tocontinue monitoring thermal conditions. In summary in the exampleembodiment, if thermal rejection from both the lid and main housingportions falls behind power dissipation, reducing power dissipation bythrottling the CPU reduces thermal energy creation to reduce systemtemperatures. Once temperatures are reduced at the housing portions,changes to the pressure adapter can once again adjust thermal transferbetween the housing portions.

Referring now to FIG. 6, a top view depicts an information handlingsystem 10 configured with thermal energy dissipation devices that spreadthermal energy across separate housing portions. In the exampleembodiment, a main housing portion 12 includes a system on chip CPU 22thermally coupled to a vapor chamber 34 that accepts and dissipatesthermal energy labeled Q_(SOC). In order to increase the amount ofthermal energy that CPU 22 can release within main housing portion 12without exceeding a threshold temperature, heat pipes 118 thermallyinterface with vapor chamber 34 to act as a thermal conduit of thermalenergy from main housing portion 12 through hinges 18 to lid housingportion 14. Lid housing portion 14 includes vapor chambers 34 onopposing sides of lid housing portion 14 and a heat spreader 116disposed between vapor chambers 34 that dissipates heat transferred frommain housing portion 12. Heat spreader 116 is, for example a sheet ofgraphite that couples to each vapor chamber 34 within lid housingportion 14. In alternative embodiments, other structures may spreadthermal energy, such as a battery that power information handling system10 or the material of lid housing portion 14. Spreading thermal energyacross main and lid housing portions 12 and 14 provide a large surfacearea for rejection of the thermal energy to the external environmentwhile also maintaining a reduced temperature for a given thermal state.

In the example embodiment, interfacing multiple thermal energydissipation devices provides control of temperature states acrossinformation handling system 10. Starting with lid housing portion 14,control of the efficiency with which vapor chambers 34 dissipate thermalenergy at opposing sides of housing portion 14, such as by actuation ofa pressure adapter within each vapor chamber 34, controls temperaturesat opposing ends of lid housing portion 14. If, for example, one sidebecomes warmer than the other, adjustments of pressure within each vaporchamber 34 controls dissipation of thermal energy to achieve a moreuniform temperature at lid housing portion 14's outer surface.Similarly, if a battery or display temperature reaches a limit,increasing pressure within vapor chambers 34 reduces thermal energydissipation towards the center of lid housing portion 14 to maintaintemperature operating constraints for the battery and/or display.Thermal conduits 118 provide another thermal energy dissipationmanagement tool to control temperatures across information handlingsystem 10. For example, thermal conduits 118 may integrate a vaporchamber or other fluid thermal energy transfer mechanism as describedbelow that impacts the amount of thermal energy transferred betweenhousing portions 12 and 14. For instance, increased pressure within avapor chamber thermal conduit 118 reduces thermal energy transfer alongthe length of thermal conduit 118. Similarly, adjustments of saturationpoints in adjacent vapor chambers impacts how efficiently thermal energytransfers from one vapor chamber to an adjacent vapor chamber. In analternative embodiment that pumps heated fluid in liquid form acrosshousing portions, thermal management may be enforced by controlling thepump speed.

Hinges 18 and their thermal interface with thermal conduits 118 provideanother control location for transfer of thermal energy between housingportions 12 and 14. For example, rather than increasing pressure withinthermal chamber 34 to decrease transfer of thermal energy out of mainhousing portion 12, increasing the thermal resistance at hinges 18reduces thermal transfer to lid housing portion 14. In the exampleembodiment, each hinge 18 is a two axis hinge that supports 360 degreesof rotation of the housing portions relative to each other. Each thermalconduit passes along a rotational axis of a hinge 18 to pass thermalenergy through a thermally conductive structure defined by the body ofhinge 18. For example, as described in greater detail below, thermallyconductive structures integrated in hinge conduct thermal energy betweenthermal conduits associated with each axis. As another example, fluidintegrated in each hinge 18 transfers thermal energy between thermalconduits 118 with convection that, in some embodiments, includes phasechange between liquid and gas states having saturation point managementwith an integrated pressure actuators, such as a wax motor.

Referring now to FIG. 7, a side perspective view depicts a hinge 18rotationally coupling main and lid housing portions 12 and 14 through athermally conductive hinge body. In the example embodiment, a hingebracket 122 couples hinge 18 to each housing portion 12 and 14 and tohinge body 120 so that rotational forces are managed separately fromthermal transfer. As set forth below, rotation about the coupling ofbracket 122 to hinge body 120 may be managed with gears or othersynchronization devices not shown in FIG. 7. In the example embodiment,a thermal interface between hinge 18 and each housing portion 12 and 14is provided with a vapor chamber 34, although in alternative embodimentsalternative types of thermal conduits may be used, such as heat pipes,graphite cables and liquid pipes as described herein. In the exampleembodiment, each vapor chamber 34 is held in a secure manner relative toits associated housing and hinge axis so that forces associated withrotation of the housing portions are translated through brackets 122with minimal force applied to vapor chambers 34. For example, hinge body120 defines two separate openings that have a thermally conductivematerial between them. A conductive barrel 124 inserts into each of theopenings to accept thermal energy from a vapor chamber 34 and totransfer the thermal energy across the thermally conductive material ofhinge body 120 to a conductive barrel 124 inserted in the other opening.Each vapor chamber 34 inserts into a conductive barrel 124 of a separateopening of hinge body 120 to transfer thermal energy Q across hinge body120 and into the other housing portion. Thermal grease 126 is pressedinto the interior of each conductive barrel 124 to encourage heattransfer between the inserted vapor chamber 34 and conductive barrel 124and reduce friction associated with hinge body 120 movement about eachaxis. In various embodiments, conductive barrel 124 may be fixedrelative to hinge body 120 or may rotate relative to hinge body 120 tofurther reduce transfer of any frictional forces to vapor chamber 34. Inthe example embodiment, vapor chamber 34 is a three dimensional vaporchamber that transfers thermal energy as a heat pipe from main housingportion 12 to hinge 18. Heat in main housing portion 12 transitions afluid to gaseous form so that the gas expands to the portion of vaporchamber 34 that is located in hinge 18. Within hinge body 120, the fluidtransitions from vapor to liquid form to release heat and wicks back tothe portion of vapor chamber 34 in main housing portion 12. Heat fromhinge 18 passes through another vapor chamber 34 or other heat pipestructure to lid housing portion 14. For example a vapor chamber 34extending from hinge 18 to lid housing portion 14 may be brazed and/orsoldered to a flat plate or vapor chamber disposed in lid housingportion 14. Alternatively, a three dimensional vapor chamber may extendfrom hinge 18 to lid housing portion 14 so that fluid transfers as avapor in hinge 18 to release heat in a transition to a liquid in lidhousing portion 14.

Referring now to FIG. 8, a cutaway view depicts a hinge 18 having athermal conduit 34 inserted into a conductive barrel 124 to conduct heatacross the hinge body 120. Conductive barrel 124 is, for example, abrass insert that engages with hinge body 120 and has low thermalresistance. Thermal grease 126 inserted between the thermal conduit,which in the example is a vapor chamber, and conductive barrel 126encourages thermal energy transfer while supporting rotation of hingebody 120 and conductive barrel 124 about vapor chamber 34. A bushing 128on each end of conductive barrel 124 seals thermal grease 126 in placewith the level of the seal depending upon the type of thermal greaseselected. Thermal energy transfers across a conductive material of hingebody 120 between the conductive barrels 124, while physical forcesapplied against the thermal conduit are minimized through a separaterotational coupling mechanism, such as brackets 122.

Referring now to FIG. 9, a cutaway view depicts a hinge 18 having afluid filled body 120 that transfers thermal energy between rotationallycoupled housing portions 12 and 14. In the example embodiment, thermalenergy transferred from one housing portion through a thermal conduit118 is transferred through a fluid integrated in hinge body 120 to athermal conduit 118 associated with the other housing portion. The fluidintegrated in hinge body 120 may be water or any other liquid and/or gasthat has low thermal resistance. In the example embodiment, frictionfins 132 extend from the outer surface of each thermal conduit 118 tohelp convective transfer of thermal energy by moving within the liquid130, such as during rotation of housing portions relative to each other.In addition to adding convective motion to liquid 130, friction fins 132provide dampening against rotational motion, such as when a lid housingportion closes next to a main housing portion. In such an exampleembodiment, thermal conduit 118 may have a more resilient constructionto withstand rotational forces, such as a copper wire or tube, however,the rotational forces are primarily managed with a hinge structure, suchas brackets 122.

Referring now to FIG. 10, a side perspective view depicts a hinge 18having thermal conduits integrated through synchronized axes to exchangethermal energy at the hinge body 120. In the example embodiment, firstand second vapor chambers 34 transfer thermal energy between hinge 18and first and second housing portions coupled to first and secondbrackets 122. Gears 132 couple with each bracket 122 to synchronizerotation of the brackets about the dual axes. A friction element 134engages axle elements extending from gears 132 to generate friction thatmanages rotational movement of housing portions coupled to brackets 122.In alternative embodiments, other types and arrangements ofsynchronizing mechanisms may be used where the hinge provides structuralintegrity that prevents stress from being applied to thermal conduits,such as vapor chambers 34. In the example embodiment, hinge body 120,shown as a greyed-out form, encloses friction element 134 and a thermaltransfer medium, such as a fluid 130. A vapor chamber 34 transferringthermal energy into a first axis of hinge 18 releases the thermal energywithin hinge body 120, such as with a phase change of fluid in the vaporchamber from gaseous to liquid form. The thermal transfer medium, suchas fluid 130, accepts the thermal energy for transfer to the vaporchamber of the second axis. The direction of thermal transfer may becontrolled by adjusting pressure within the vapor chambers 34 so thatsaturation points keep the temperature of the source vapor chambergreater than the target vapor chamber. In alternative embodiments, asolid thermal transfer medium may be used to transfer thermal energybetween hinge 18's vapor chambers 34, such as a copper or brass conduitintegrated in friction element 134.

Referring now to FIG. 11, a side cutaway view depicts a hinge 18integrating a vapor chamber 34 that transfers thermal energy betweenthermal conduits coupled to the hinge and rotationally coupled housingportions. In the example embodiment, hinge body 120 integrates a vaporchamber 34 that includes a sintered powder wicking structure 134 oninterior surfaces to improve evaporation, condensation and liquidtransport of a fluid 130 disposed in the vapor chamber 34 locatedbetween the thermal conduits. A wax material 136 adjacent fluid 130melts at a temperature threshold associated with a thermal limit fortransfer of thermal energy across hinge 18 to compress fluid 130 andincrease the saturation point, thus resulting in less efficient thermaltransfer through hinge 18. At temperatures below the threshold, thermalenergy passes through fluid 130 by transitioning fluid 130 betweenliquid and gaseous states. At the threshold, melting of wax 136increases the saturation point so that thermal energy is transferredacross hinge 18 less efficiently. In alternative embodiments,alternative types of control, such as active control managed by amicrocontroller or other processor, may be used to adjust transfer ofthermal energy across hinge 18.

Referring now to FIG. 12, an exploded view depicts a hinge 18 havingthermal transfer performed with an integrated vapor chamber 34. In theexample embodiment, thermal conduits 118 transfer thermal energy with athermally conductive material, such as copper or graphite heat pipe or avapor chamber, which thermally couples to an insert 138, such as a brasscylinder. For example, each thermal conduit interfaces with a housingportion to conduct thermal energy to and/or from the housing portion.Insert 138 rotationally couples with a sleeve 140 to support rotationalmovement of thermal conduits 118 as housing portions rotate relative toeach other. Thermal energy transfers between insert 138 and sleeve 140with the aid of thermal grease. Sleeves 140 fit into hinge body 120 toprovide a thermal interface with a vapor chamber formed within hingebody 120. A backing plate 142 seals the vapor chamber within hinge body120. The insert and sleeve construction of hinge 120 reduces manufacturecomplexity by allowing a vapor chamber within hinge body 120 to be builtand pressurized separate from the assembly of hinge 18. At manufactureof an information handling system, thermal conduits 118 of various typesfit into a common hinge by interacting through a common insert 138 andsleeve 140.

Referring now to FIG. 13, a bottom perspective cutaway view depicts aninformation handling system 10 having liquid fluid thermal energytransfer through a dual axis hinge. In the example embodiment, a fluidexhaust line 144 carries liquid from a main housing portion 12 to a lidhousing portion 14, and a fluid return line 146 carries liquid from lidhousing portion 14 to main housing portion 12. The path of fluid exhaustline 144 and fluid return line 146 traverses the location of each hingeaxis with the hinge removed from the view for clarity. Liquid is heatedat a cold plate 148 that thermally couples to a heat source of mainhousing portion 12, such as a CPU. A pump integrated with cold plate 148pumps heated fluid into fluid exhaust line 144 and accepts the liquidback through fluid return line 146. A thermal controller or otherprocessing device executes logic that manages thermal energy transfer,such as to keep temperatures of main housing portion 12 and lid housing14 within desired parameters as describe above. In various embodiments,cold plate 148 may couple directly to a heat source, such as a CPU, ormay couple indirectly to a heat source, such as to a heat sink or vaporchamber that couples directly to a CPU. A pump to transfer heat liquidmay integrate in cold plate 148 or may be installed separately tointerface with cold plate 148. In the example embodiment, both fluidexhaust line 144 and fluid return line 146 pass along the same pathbetween main housing portion 12 and lid housing portion 14. Inalternative embodiments, fluid exhaust line 144 and fluid return line146 may pass through separate hinges, such as at opposing sides ofinformation handling system 10. In one alternative embodiment, liquidmay be used to directly transport thermal energy to a hinge, which thenpasses the thermal energy to an opposing housing portion through otherthermal transfer structures, such as those describe above. Variouscombinations of the thermal transfer structures described herein may beused to transfer thermal energy within and between housing portions.

Referring now to FIG. 14, a side perspective view depicts a hinge 18having liquid pumped through each axis to support thermal transferbetween information handling system housing portions. In the exampleembodiment, a pump 152, such as a pump integrated in a cold plate 148,pumps liquid from a first housing portion towards hinge 18 through afluid exhaust line 144. The fluid passes through the hinge 18 at a firstaxle to exit out at a second axle. Hinge 18 provides rotation about twoaxes with a bracket 122 at each axis coupling to an information handlingsystem housing portion. Each bracket 122 couples to a gear mechanism 132that translates rotation of the brackets in a synchronized manner. Afriction element 134 engages the axles to regulate rotation of brackets122 by generating friction that resists rotation. Fluid passes into thefirst axle, such as through a flexible fluid line that passes through achannel defined in the first axle, to exit at a guide 150 that directsthe fluid line into the second axle. The fluid exhaust line proceedsthrough the second axle and out to the second information handlingsystem housing portion. In the example embodiment, fluid flows in onedirection only so that return of fluid to pump 152 is supported with asecond hinge that integrates a fluid line and flows fluid in an oppositedirection. In an alternative embodiment, two separate fluid lines maypass through hinge 18 to support fluid exhaust and return through asingle hinge 18. In an alternative embodiment, the axles of hinge 18 mayhave a contiguous construction to support fluid flow and obviate the usea separate fluid line. Quick connects or other fluid tight couplingmechanisms may be used to couple fluid lines to hinge 18.

Referring now to FIG. 15, a side perspective view depicts an informationhandling system lid housing portion 14 that integrates a vapor chamber34 to dissipate and reject thermal energy received from a main housingportion. Generally, convertible portable information handling systemsthat have rotationally coupled housing portions tend to havesubstantially the same surface area in each housing portion. With such aconfiguration, rejecting thermal energy from both housing portionseffectively doubles the surface area from which thermal energy transfersto the external environment. Thus, by using the various systems,apparatuses and techniques described herein to transfer thermal energybetween housing portions, greater power dissipation is supported fromprocessing components, such as the CPU, while maintaining systemtemperatures within defined limitations. Protrusion 154 integrates at abase side of lid housing portion 14 near where hinges 18 couple so thatthermal energy transferred from a main housing portion can dissipateacross the surface of lid housing portion 14.

Referring now to FIG. 16, a side view depicts protrusion 154 and opening156 configured to accept a thermal conduit that transfers thermal energyfrom a main housing portion. In the example embodiment, opening 156defines a channel within protrusion 154 that accepts a thermal conduit118 to provide enhanced thermal transfer about the channel surface. Inone example embodiment, a thermal conduit inserts through opening 156 torotate within the channel as lid housing portion 14 rotates relative tomain housing portion 12, such as with thermal grease inserted betweenthe thermal conduit and channel surface. In an alternative embodiment,the thermal conduit may fixedly couple within protrusion 154. Variousthermal conduits may be fitted to insert in protrusion 154. For example,heated liquid may be pumped through a thermally conductive line thatpasses through opening 156. As another example, a vapor chamber may passa gaseous fluid through protrusion 154 to condense to liquid and releasethermal energy, after which the condensed liquid is returned to the mainhousing portion, such as encouraged by gravity feed. In anotheralternative embodiment, a thermal conductive cable may pass from themain housing portion to insert into opening 156. In yet anotheralternative embodiment, a hinge pin that rotationally couples thehousing portions to each other by inserting into opening 156 alsointegrates a thermal conduit so that thermal energy passes through theactual hinge structure to the lid housing portion 14. For instance, asingle axis hinge couples main and lid housing portions together torotate about one axis, such as with a pin that inserts into a knuckleformed at the lid housing portion. A single axis hinge typically willnot support 360 degrees of housing rotation, however, a convertible formfactor that includes a tablet configuration is not included in somesystems and provides more direct thermal transfer comparted to dual axishinge assemblies. An example of such a system is depicted in FIG. 19described below.

Referring now to FIG. 17, a side perspective view depicts a thermalconduit inserted into protrusion 154 to transfer thermal energy to lidhousing portion 14. In the example embodiment, a vapor chamber 34 havinga cylinder shape inserts into protrusion 154 to transfer thermal energyto lid housing portion 14. Fluid in a gaseous state passes from the mainhousing portion to condense and release thermal energy within protrusion154. At condensation of the fluid within the opening 156 of protrusion154, thermal energy is released and the fluid in the liquid statereturns to the main housing portion to accept more thermal energy. Asset forth above, other types of thermal conduits may be used to transferthermal energy within protrusion 154.

Referring now to FIG. 18, a side cutaway view of a vapor chamber 34integrated at a protrusion 154 extending from a lid housing portion 14.A space defined between the inner walls of protrusion 154 and opening156 forms a chamber that contains a fluid at a reduced pressure so thatat a saturation point the fluid transitions from a liquid to a gaseousstate. When lid housing portion 14 is rotated to a viewing position,heated gas rises, condenses and then returns to the base of protrusion154 in a liquid state to accept additional thermal energy from a thermalconduit inserted in opening 156. In one example embodiment, vaporchamber within lid housing portion 14 extends upwards from protrusion154 to a chamber of substantially the same area as lid housing portion14. For example, lid housing portion 14 has an outer surface layer ofstainless steel, titanium, copper, aluminum with a polymere coating orother materials used to form an information handling system outersurface. A secondary sheet of material is coupled on the inner side ofthe outer surface material to define a chamber between the outer surfacelayer and secondary sheet of material, such as with a half of amillimeter spacing across substantially all of the surface area of thelid housing portion. Within lid housing portion 14, vapor chamber 34dissipates thermal energy across the surface area of lid housing portion14 with reduced thermal resistance and vertical height.

Referring now to FIG. 19, a portable information handling system 10 in aclamshell open configuration transfers thermal energy from main housingportion 12 to a lid housing portion 14 with a thermal conduit 40disposed through a single axis hinge 18. In the example embodiment,hinge 18 has a “three knuckle” configuration in which a protrusion 154of lid housing portion 14 holds a pin anchored at opposing ends in mainhousing portion 12. Thermal conduit 40 proceeds from main housingportion 12 through hinge 18's central pin to transfer thermal energy tothe inner surface of protrusion 154's opening 156. The exampleembodiment depicts thermal conduit 40 entering at one end of protrusion154 and exiting at an opposing end, such as may be used to pump fluid ina liquid state through the length of protrusion 154. In alternativeembodiments, thermal conduit 40 may enter protrusion 154 from one sideonly, such as with a cable that transfers thermal energy from onelocation of main housing portion 12.

Referring now to FIG. 20, an example embodiment depicts a thermalconduit routed through outer and inner portions of a single axis hinge18. In the example embodiment, thermal conduit 40 is a cable that routesthrough a center portion of hinge 18 from the outer periphery of hinge18's mounting location inwards towards protrusion 154. In one exampleembodiment, thermal conduit 40 routes with other interface wires, suchas power and graphics communication cables through a channel defined inthe pin of hinge 18 that proceeds through protrusion 154. For instance,thermal conduit 40 is a copper cable that is exposed in protrusion 154to transfer thermal energy into lid housing portion 14. FIG. 21 depictsan alternative arrangement for passing thermal conduit 40 through hinge18 at the inner periphery of hinge 18's mounting location, such as whereless rotational movement is provided between the housing portions.

Referring now to FIG. 22, a lid housing portion 14 is depictedintegrating a thermal conduit 40 that transfers thermal energy fordissipation across the lid housing portion's surface area. In theexample embodiment, thermal conduit 40 is graphite having one or morelayers of graphene that efficiently transfers thermal energy in planeacross the inner surface of lid housing portion 14 to integrated copperfilms 158 located at a distal perimeter of lid housing portion 14relative to the entry of thermal conduit 40, such as at a hingeinterface. For example, a pattern for thermal conduit 40 is cut from asheet of graphene/graphite material and then fixed to lid housingportion 14's inner surface with adhesive. Graphite and/or grapheneprovides high in plane thermal conductivity of approximately 1600 W/mKwith minimal cross plane thermal conductivity of approximately 3 W/mK.Thus, in the example embodiment, thermal energy is transported throughthermal conduit 40 to copper film 158 in plane with minimal transfer outof plane from thermal conduit 40 directly to lid housing portion 14.Thermal conduit 40 couples in plane to copper film 158 so that thermalenergy dissipates to the material of lid housing portion 14 primarilythrough the thermal interface provided by copper film 158 to lid housingportion 14. As is set forth below, thermal conduit 40 may be cut fromone or more sheets of graphene so that a contiguous piece of materialconducts thermal energy from main housing portion 12 through a hinge 18to lid housing portion 14 for dissipation across the surface area of lidhousing portion 14. Concentrations of thermal energy in lid housingportion 14 that might cause discomfort to an end user may be avoided bydirecting thermal energy to distributed locations of lid housing portion14. For purposes of clarification, those of skill in the art willrecognize that the common usage of the terms graphene and graphitesometimes strays from the strict scientific definitions. Graphene is oneatomic layer of graphite having carbon atoms arranged in a hexagonal orhoneycomb lattice. Graphite in natural or synthetic form is composed ofmultiple layers of graphene. Synthetic graphite is typicallymanufactured with a mixture of graphene and graphite to enhance desiredproperties, such as sheer strength and thermal conductivity. As usedherein the terms graphite and graphene are not mutually exclusive andmay include various naturally occurring and synthetic forms that achieveimproved thermal conductivity.

Referring now to FIG. 23, a side cutaway view depicts an example of agraphite thermal conduit 40 having plural layers of graphene stackedwithin each graphite film 164. Each graphite film 164 includes pluralgraphene layers that transfer thermal energy in plane. Generally as usedherein graphene refers to one layer of graphite. Increasing thethickness of a graphite film generally does not improve thermalconductance as thermal transfer for graphite film remains fairlyconsistent independent of film thickness. For example, a graphite filmof 0.017 mm thickness provides approximately 1600 Wm−K of thermalconductivity while a similar film of 0.040 mm thickness providesapproximately 1350 Wm−K of thermal conductivity. In order to enhancethermal energy transfer through a graphite/graphene thermal conduit 40,multiple separate layers of graphite are integrated into a cable form sothat each separate layer of graphite separately transfers thermalenergy. In the example embodiment, thermal conduit 40 has an outer PETprotective film 160 that protects the graphite and couples through asingle sided adhesive film 162 to an upper graphite film 164. Twoadditional graphite films 164 are layered between double sided adhesivefilms with a bottom PET protective film protecting the graphite. In theexample embodiment of FIG. 23, graphite films 164 are cut into strips ofa desired sized cable and, optionally, wrapped in insulation to limitundesired thermal energy escape at cable midpoints. FIG. 24 shows anoptional cable configuration in which multiple sheets of graphite 164are layered on top of each other and then rolled into a cable formhaving an outer protective layer 160. Each layer of graphite provides aseparate thermally conductive pathway to transfer thermal energy withthe rolled form factor stabilizing the graphite material in a reinforcedmanner.

Referring now to FIG. 25, a multilayered graphite thermal conduit 40 isdepicted configured to transfer thermal energy from vapor chamber 34with multiple thermal interface connection points dispersed across thesurface of vapor chamber 34. In the example embodiment, CPU 22 generatesthermal energy as a byproduct of execution, which dissipates power. Aheat sink 32 couples to CPU 22 to capture thermal energy and reducethermal spikes by providing a mass that absorbs thermal energy. Vaporchamber 34 couples to heat sink 32 and accepts thermal energy to aid indissipation of the thermal energy across a greater surface area usingphase transition of a fluid in a low pressure chamber having a desiredsaturation point. For instance, vapor chamber 34 may extend across asurface area of substantially the size of a main housing portion thatcontains CPU 22, where the greater surface area provides increasedthermal energy rejection to the external environment. Thermal conduit 40is a composite cable that includes plural graphite layers 164 that eachtransfer thermal energy from vapor chamber 34. In order to improvethermal transfer from vapor chamber 34, each individual graphite layer164 independently couples to vapor chamber 34 to accept thermal energyfrom disparate locations across the surface area of vapor chamber 34.The individual layers of graphite 164 then integrate into one compositecable structure to pass through a hinge or other path to a targetthermal device that accepts the thermal energy.

Referring now to FIG. 26, a multilayered graphite thermal conduit 40 isdepicted having each of plural layers of graphite 164 thermallyinterfaced at dispersed locations of a heat sink 32 and informationhandling system lid portion 14. In the example embodiment, heat sink 32includes plural cooling fins that extend upward to increase thermalrejection through increased surface area exposed to air. Thermal conduit40 includes three graphite layers combined in a composite cable andhaving each graphite layer 164 independently terminating at a separatecooling fin 166. The composite thermal conduit passes as a contiguouspiece to a lid housing portion 14 that accepts thermal energy from heatsink 32. A vertically oriented lid housing portion, such as in theclamshell open configuration, offers a large surface area exposed to anexternal environment that encourages rejected thermal energy to riseaway from the information handling system. In the example embodiment, acopper film 156 is located at the perimeter of lid housing portion 14and integrated with the lid housing portion material. Thermal conduit 40couples to lid housing portion 14 at three contact points 168 with eachgraphite layer 164 coupled to a different contact point. Thermal energythat interfaces with copper film 156 spreads through the perimeter oflid housing portion 14 and into the material of lid housing portion 14.A direct thermal coupling of graphite layer 164 to lid housing portion14 may provide a less efficient thermal transfer at a central locationthat tends to even the temperature across lid housing portion 14. In onealternative embodiment, copper film 156 or other thermal spreaders, suchas graphite and/or aluminum, may extend across substantially all of theinner surface area of lid housing portion 14 to further enhance thermaldissipation.

Referring now to FIG. 27, an information handling system 10 in aclamshell open configuration depicts a layered graphite thermal spreader170 cut and folded to interface housing portions 12 and 14 in a torsionspring configuration. Graphite thermal spreader 170 has a firstextension that thermally couples with lid housing portion 14 and asecond extension that thermally couples with main housing portion 12. Acentral portion rolls around a hinge shaft or pin to fit in a seamlessmanner between the housing portions so that thermal energy istransferred across a contiguous piece of graphite. In the exampleembodiment, the extensions offset from the central portion on oppositesides of the central portion define the opposing ends of a torsionspring that tightens and loosens as the housing portions rotate relativeto each other. Graphite thermal spreader 170 has the springconfiguration in an opposite orientation at each hinge 18 so that bothspring configurations tighten as the housing portions rotate to a closedposition and loosen as the information rotates from the closed to anopen position. In one embodiment, the torsion spring configuration wrapsat a worst case angle so that during rotation the material unwinds orloosens. In an alternative embodiment, the torsion spring configurationattaches to a non-rotating hinge shaft with slack added between theshaft and connection to thermal spreaders in the housing portions. Thetorsion spring configuration provides a smallest path between thermalspreaders with a single rotation about the hinge shaft or pin.

FIG. 28 depicts a graphite sheet cut to wrap around a hinge shaft 172 ina torsion spring configuration of graphite thermal spreader 170. In theexample embodiment, opposing L shaped pieces cut from a single graphitesheet provide a contiguous graphite form that wraps once around a hingepin 172 as shown. For instance, as the center portion of graphitethermal spreader 170 wraps around hinge pin 172, the opposing extensionssupport the torsion spring configuration without any overlap of theextensions. In one alternative embodiment, multiple layers of graphitesheets are stacked as describe above so that the torsion springconfiguration transfers thermal energy through the multiple layers ofgraphite.

Referring now to FIG. 29, opposing graphite thermal spreaders 170interface through a strip 176 that supports multiple wraps around ahinge pin or shaft. In the example embodiment, first and second graphitesheets 174 are cut to substantially the same area as the lid and mainhousing portions. For instance, each graphite sheet 174 couples to aperimeter of one of the housing portions to transfer thermal energyacross the graphite, resulting in a more consistent temperature acrosseach housing portion. Strip 176 couples the opposing graphite sheets 174to each other so that thermal states between the graphite sheets 174 andtheir associated housing portions tend towards equalization. Strip 176has a length that provides for multiple wraps around a hinge shaft orother structure between the housing portions. In the example embodimentwith a graphite thermal spreader that has limited out-of-plane thermalconductance, multiple wraps of strip 176 provide additional material tohold transient surges in thermal energy without release at the hinge.

Referring now to FIG. 30, a side perspective view depicts an informationhandling system 10 having graphite thermal spreaders 178 extended acrosssubstantially all of first and second rotationally coupled housingportions 12 and 14. In the example embodiment, graphite thermal spreader178 is a contiguous sheet of one or more layers of graphite thatefficiently transfer thermal energy in plane. Information handlingsystem 10 has housing portions 12 and 14 rotated about a hinge 18 to atablet configuration. Graphite thermal spreader 178 passes betweenhousing portions 12 and 14 to spread thermal energy generated atinformation handling system 10 across both housing portions, thusaveraging down the system temperature for a given thermal state. As anexample, thermal spreader 178 thermally couples to each housing portion12 and 14 so that an imbalance in temperature between the housingportions is evened out by thermal energy transfer through thermalspreader 178. As is set forth in greater detail below, a tensioningmechanism located between housing portions 12 and 14 maintains tensionat thermal spreader 178 so that the graphite material folds and adjustsduring rotation of the housing portions.

Referring now to FIG. 31, a side perspective view depicts theinformation handling system 10 having the housing portions 12 and 14rotated to a closed position. Graphite thermal spreader 178 has to havea greater length in the closed configuration compared to the tabletconfiguration depicted by FIG. 30 due to the greater circumferencearound the housing portions at the outer surface. A tensioning mechanismassociated with hinge 18 adjusts the length of graphite thermal spreader178 by releasing part of graphite thermal spreader 178 from a foldedcondition in the tablet configuration to an extended position in theclosed configuration. Graphite thermal spreader 178 has substantiallythe same area as the rotationally coupled housing portions with eachportion coupled at its perimeter to spreader 178. Some parts of graphitethermal spreader 178 have openings and connection points that leaveuncovered parts of housing portions 12 and 14. In the exampleembodiment, openings between the ends of hinge 18 and thermal spreader178 are made to support hinge movement. Other examples of uncoveredparts might include connection locations to heat producing components,openings for cable crossings, and room to fit housing covers, displays,control buttons etc . . . Generally, with these and similar exceptions,having thermal spreader 178 substantially the same area as the housingportions provides a larger surface area over which thermal energy may bedistributed.

Referring now to FIG. 32, a side cutaway view of information handlingsystem 10 depicts graphite thermal spreader 178 managed in a closedconfiguration by a tensioning assembly 180. In the example embodiment,graphite thermal spreader 178 is disposed proximate the outer surface oflid housing portion 14 and thermally interfaced with material of lidhousing portion 14 at the end of the housing distal tensioning assembly180. Proximity of thermal spreader 178 to lid housing portion 14 aidstransfer of thermal energy to lid housing portion 14 for dissipationacross the housing material and rejection to the external environment.In the example embodiment, lid housing portion 14 typically has lessthermal energy released than main housing portion 12 and is thusconfigured primarily to receive and dissipate the thermal energy. Mainhousing portion 12 includes processing components that use and dissipatepower to create thermal energy, such as a CPU. A vapor chamber 34thermally interfaces with the processing components to dissipate thethermal energy across main housing portion 12 and also thermallyinterfaces with graphite thermal spreader 178 to transfer thermal energythrough tensioning assembly 180 to lid housing portion 14. As set forthabove, graphite thermal spreader may be assembled as a composite ofmultiple layers of graphite sheets coupled with adhesive andtransferring thermal energy by coupling to heat sources and sinks inplane with enhanced thermal conductivity at independent locations.

In the example embodiment, graphite thermal spreader 178 has its tensionand bend radius managed by first and second sets of parallel tensionbars 184 that define a slot through which graphite thermal spreader 178passes. In the closed configuration, parallel tension bars 184 arevertically stacked to pull graphite thermal spreader 178 towards thehinge side of information handling system 10 so that sufficient materialis available for thermal spreader 178 to pass between main housingportion 12 and lid housing portion 14. As is set forth below in greaterdetail, tensioning assembly 180 integrates a clutch that providesrotation of parallel tensioning bars 184 independent of housingorientation so that tension across thermal spreader 178 is maintainedover variations in material size and wear.

Referring now to FIG. 33, a side cutaway view depicts informationhandling system 10 graphite thermal spreader 178 managed in a tabletconfiguration by a tensioning assembly 180. Thermal spreader 178 remainsdisposed in lid housing portion 14 proximate the outer surface and inmain housing portion 12 near heat-generating processing components andvapor chamber 34. Tensioning assembly 180 has rotated so that thermalspreader 178 wraps around parallel tension bars 184 to control excessmaterial of thermal spreader 178. The amount of material between housingportions 12 and 14 is diminished due to the reduced outer circumferencefollowed by thermal spreader 178. A bend radius of thermal spreader 178is maintained by the radius of tension bars 184 so that undue stress isnot place upon graphite thermal spreader 178 that might lead to crackingor breaking. In one alternative embodiment, tensioning assembly 180manages thermal spreader 178 during rotation from the flat tabletconfiguration depicted in FIG. 33 to a folded tablet configuration inwhich lid housing portion 14 rotates 360 degrees relative to mainhousing portion.

Referring now to FIG. 34, an upper perspective exploded view depicts agraphite thermal spreader 178 aligned to couple with an informationhandling system 10. In the example embodiment, a hinge 18 rotationallycouples first and second housing portions to each other, such as with adual axis 360 degree synchronized motion. First and second tensioningassemblies 180 each include first and second parallel tension bars 184that define a slot 182 through which graphite thermal spreader 178inserts. Each tension assembly 180 aligns with a hinge axis on opposingsides of information handling system 10. In one example embodiment,thermal spreader 178 assembles into the tensioning assemblies 180 forsubsequent assembly into information handling system 10. Tensionassemblies 180 snap into position on hinges 18 and then graphite thermalspreader 178 thermally couples to fixed locations of housing portions 12and 14, such as with an adhesive.

Referring now to FIG. 35, an upper perspective view depicts a paralleltension bar assembly 180 configured to rotate with a thermal spreadercaptured in a slot 182 to maintain tension across the thermal spreader178. A connector assembly 186 couples to each end of the parallel barassembly 180 to hold parallel tension bars 184 in place. A pin opening188 at the outside surface of connector 186 couples to a pin extendingfrom a hinge 18, as described below.

Referring now to FIG. 36, an exploded view of both ends of paralleltension bar assembly 180 depicts a clutch assembly that adaptstensioning bar orientation to variations in thermal spreader tension. Inthe example embodiment, a spring 192 works through ramped surfaces tobias graphite thermal spreader 178 to a tightened condition. Paralleltension bars 184 insert into a base 190 of connector 186. A wave spring192 bias apart a flat surface of base 190 and an inner ramp piece 194. Aramped surface of inner ramp piece 194 engages against an opposingramped surface of outer ramp piece 196 so that pieces 194 and 196 workagainst wave spring 192 when their relative rotational orientationchanges, such as during rotation of connector 186. Wave spring 192 andramped surfaces on pieces 194 and 196 interact to create a clutch thatallows rotation of parallel tension bars 184 independent of hinge 18with an increased spring compression as the rotational angle increases.Increased spring compression forces the ramped surfaces to return to analigned position so that, as parallel tension bars 184 align with hinge18, the tension placed on thermal spreader 178 decreases. The persistentramp and spring interactions tend to maintain at least a minimal tensionworking against thermal spreader 178 at all times.

Referring now to FIGS. 37A and 37B, an example of tension adjustmentsapplied by the tensioning bar clutch assembly is depicted. FIG. 37Adepicts hinge 18 rotated 180 degrees to an open tablet configuration sothat both housing portions rest in a common plane. As shown in theaccompanying cutaway view, parallel torsion bars 184 are aligned withhinge 18 axes in the same plane as the housing portions. The clutchassembly in connector 186 has biased parallel torsion bars 184 to havethe same orientation as hinge 18 axes. FIG. 37B depicts hinge 18 in thesame 180 degree rotation as FIG. 37A, however, connector 186 has rotatedslightly to adjust tension on thermal spreader 178. Parallel torsionbars 184 are rotated out of alignment with hinge axes 18 so that eachouter bar is raised slightly. In one example embodiment, a limit ofapproximately 15 degrees is built into the clutch assembly, such as inthe opposing ramps, so that parallel torsion bars 184 rotateindependently of hinge 18 only up to the limit.

Referring now to FIG. 38, an exploded view depicts a hinge 18 configuredto couple with a parallel tension bar assembly. Hinge 18 couples to eachhousing portion 12 and 14 with opposing brackets 122. Each bracket 122couples to an axis of hinge 18 where, in the example embodiment,movement of each axis is synchronized with a synchronization mechanismwithin hinge 18, such as gears. In the example embodiment, a pin 198extends outward from each hinge axle to insert into an opening ofconnector 186, thus allowing connector 186 to rotate about pin 198.Connector 186 is held in position between opposing hinges by coupling ofhinges 18 to housing portions 12 and 14 so that parallel tension barscannot slide laterally to remove pin 198 from connector 186. A rotationlimiting device 200 includes an eye opening and second pin located atthe perimeter of the hinge axle that restricts independent movement ofconnector 186 relative to hinge 18. Rotation limiting device 200 insertsinto an opening of outer ramp piece 196 of connector 186. The positionof rotation limiting device 200 is maintained relative to bracket 122 sothat at a rotation limit bracket 122 motion is translated to connector186. Within a rotation limit, the orientation of connector 186 relativeto the orientation of bracket 122 varies based upon the amount oftension on thermal spreader 178 and the ramp 194 and 196 with spring 192interactions of the clutch mechanism.

Referring now to FIG. 39, an exploded view depicts a hinge configured tocouple with a parallel tension bar assembly. Synchronized axle motion isprovided by a gear 132 coupled to each bracket 122 and interconnected byan intermediate gear not shown. The brackets 122 and gears 132 are heldin position by opposing gear housings 202 and 204 that couple to eachother with a screw or other coupling device. A rotation limiting pin 206inserts through an eye formed in each axle proximate center pin 198.Rotation limiting pin 206 slides in an arc about center pin 198, such aswith rotation of connector 186 coupled to pin 198. The interaction ofrotation limiting pin 206 and the arc opening at each axle defines therotation limiting device that keeps the torsion bar assembly within arotational orientation limit of hinge 18 axle rotational orientation.

In various embodiments, the present disclosure provides a flexible toolthat adapts information handling system housing portions to spread,dissipate and reject excess thermal energy efficiently and passively.Low profile information handling systems have minimal vertical height tocontain processing components, however, housing length and width aretypically driven by display screen size. Thermal transfer betweenhousing portions allows greater flexibility for the distribution ofprocessing components across a system's length and width by avoidingthermal concentrations at housing locations that include heat producingprocessing components, such as a CPU and/or GPU. For example, bymanaging the direction and amount of thermal transfer between housingportions, housing outer surface temperatures may be actively controlledthrough adaptive passive thermal transfer. Such control providesimproved processing component operations so that thermal energygeneration can increase to provide greater processing power wherethermal transfer between housing portions is available. In someinstances, such as where a docking station or extra battery pack isconnected to a housing portion, thermal dissipation and rejectioncapabilities of a housing portion change so that control of thermaltransfer adapts processing capabilities at an information handlingsystem to different thermal configurations. As an example, a dual screeninformation handling system having a foldable OLED display disposedacross both housing portions allows an end user to select either housingportion as a “keyboard” main portion to accept typed inputs at akeyboard presented on a display at one of the housing portions. Bycontrolling the direction of thermal transfer between the housingportions, the keyboard portion may transfer thermal energy to the other“display” portion so that housing surface temperatures near the end userare reduced while thermal rejection at a vertically raised “display”portion is improved. Thus, dual screen devices that have a display overboth housing portions more readily adapt to end user selection of eitherof the housing portions as the keyboard input portion or displayportion. If an end user flips the information handling system, forinstance, reversal of thermal energy transfer between the housingportions adapts to the end user's selection of a housing portion forkeyboard versus display functionality.

Although the present invention has been described in detail, it shouldbe understood that various changes, substitutions and alterations can bemade hereto without departing from the spirit and scope of the inventionas defined by the appended claims.

What is claimed is:
 1. An information handling system comprising: afirst housing portion configured to hold a display; a display integratedin the first housing portion and operable to present visual images; asecond housing portion configured to hold processing components; pluralprocessing components disposed in the second housing portion andoperable to process information to define visual images for presentationat the display; a vapor chamber thermally coupled to one or more of theplural processing components, the vapor chamber configured to vaporizethe fluid with thermal energy of the one or more processing components,and distribute the vaporized fluid away from the one or more processingcomponents; an actuator interfaced with the vapor chamber and operableto adjust a pressure within the vapor chamber to change a temperature atwhich the fluid in the vapor chamber vaporizes; a controller interfacedwith the actuator and operable to set the actuator for a predeterminedpressure based upon one or more predetermined conditions; and atemperature sensor interfaced with the first housing portion and thecontroller, the predetermined condition comprising a temperature of thefirst housing portion outer surface.
 2. The information handling systemof claim 1 wherein the actuator comprises a piston in communication withthe vapor chamber, the piston moving inwards towards the vapor chamberto increase the pressure and outwards from the vapor chamber to decreasethe pressure.
 3. The information handling system of claim 2 wherein theactuator comprises a solenoid coupled to the piston.
 4. The informationhandling system of claim 2 wherein the actuator comprises a wax motorhaving wax that changes state to change the piston position.
 5. Theinformation handling system of claim 1 wherein the actuator comprises abladder integrated in the vapor chamber, the bladder inflating toincrease the pressure and deflating to decrease the pressure.
 6. Theinformation handling system of claim 1 further comprising: a hingerotationally coupling the first and second housing portions; and athermally-conductive interface integrated in the hinge and communicatingthermal energy from the second housing portion to the first housingportion.
 7. The information handling system of claim 6 wherein the vaporchamber integrates in the thermally-conductive interface to controlthermal energy transfer from the second housing portion to the firsthousing portion.
 8. The information handling system of claim 1 whereinthe predetermined condition comprises a temperature of a batteryintegrated in the first housing portion.
 9. A method for thermalmanagement of an information handling system, the method comprising:capturing thermal energy released by a processor at a first location ofthe information handling system; transferring the thermal energy througha first vapor chamber to a second location of the information handlingsystem; monitoring a temperature at the second location; and in responseto monitoring the temperature, adjusting a pressure in the vapor chamberto control thermal energy transfer to the second location.
 10. Themethod of claim 9 wherein adjusting a pressure further comprises: movinga piston into the vapor chamber to increase the pressure of the vaporchamber; and moving the piston out of vapor chamber to decrease thepressure of the vapor chamber.
 11. The method of claim 9 whereinadjusting a pressure further comprises: inflating a bladder located inthe vapor chamber to increase the pressure of the vapor chamber; anddeflating the bladder to decrease pressure of the vapor chamber.
 12. Themethod of claim 9 wherein: the first location comprises a CPU; thesecond location comprises a battery; and monitoring a temperaturecomprises monitoring the battery temperature to detect a threshold. 13.The method of claim 9 wherein: the first location comprises a basehousing portion containing a CPU; the second location comprises a lidhousing portion containing a display; and the vapor chamber integratesin a hinge rotationally coupling the base and lid housing portion toeach other.
 14. The method of claim 9 wherein: the first locationcomprises a base housing portion containing a CPU; the second locationcomprises a lid housing portion containing an OLED display; and thetemperature relates to generation of visual images at the OLED display.15. The method of claim 14 wherein the temperature further relates to anouter surface temperature of the lid housing portion.
 16. A system forthermal management of a portable information handling system, the systemcomprising: a vapor chamber containing a liquid in a sealed volume at afirst pressure that defines a first vapor saturation point for theliquid; a pressure adapter integrated with the vapor chamber andoperable to change the volume to set a second pressure that defines asecond vapor saturation point for the liquid; and a controllerinterfaced with the pressure adapter and a temperature sensor, thecontroller setting the pressure adapter to define the first or secondvapor saturation point for the liquid based at least in part upon atemperature sensed by the temperature sensor; wherein the temperaturesensor senses a temperature associated with an information handlingsystem outer housing surface.
 17. The system of claim 16 wherein thepressure adapter comprises a piston interfaced with the pressure chamberand the controller, the piston selectively increasing and decreasing thevolume in response to the controller.
 18. The system of claim 17 whereinthe pressure adapter comprises a bladder integrated in the vapor chamberand a microfluidic reservoir, the controller selectively increasing anddecreasing the volume by filling and depleting the bladder with themicrofluidic reservoir.